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Silicon Solution

DBM




Overview
DSP Group's® innovative XsoundR™ chip is a mixed-signal, DSP-based processor designed for voice communication applications. The chip implements DSP Group's HDClear™ solution to remove background noise from the voice communication link of far-end users using an XsoundR-powered device, while maintaining the privacy of near-end users. The chip's target applications include:
  • Bluetooth headsets
  • DECT cordless headsets
  • Wired headsets
  • DECT cordless phones
  • Mobile phones
 
XsoundR is designed for seamless integration into any mobile communications device. The chip includes all required analog and digital circuitry as well as digital interfaces to connect into a system. The ROM is pre-programmed with all necessary algorithms and default settings. Customers may configure the chip and fine-tune performance via a user-friendly set of parameters that eliminates lengthy software programming during integration.
Highlights
Processor
  • 16-bit DSP
  • Program memory: ROM

Application Memory
  • Serial EEPROM (optional)

Power Supply
  • 1.8V & 3.3V

AFE
  • 3 ADC and 3 microphone amplifiers, including microphone bias
  • 1 DAC and differential headphone amplifier

General Interface
  • UART
  • TDM supporting I2S, PCM
  • SPI master interface
  • I2C
  • 8 GPIO with dedicated functions for control and mode select

Advanced Features
  • Three-microphone support
  • Noise reduction: HDClear™
  • Background sound replacement

Packaging Option
  • 5.5x5.5mm BGA
 

Product Graphics

Block Diagram

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