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HDK E (Galil)




Overview
In order to enable customers to develop products based on the DCE chipset, DSP Group™ provides a range of hardware and software reference designs. Offering a full product definition, the reference designs cover both color and B&W handsets, simple CID and DTAM bases, diverse cordless standards, and multiple applications and man-machine interfaces (MMIs).
 

The HDK E's (Galil) hardware boards represent a complete hardware reference design for digital cordless phones that is based on the DCE chipset, and includes both handset and base. The HDK is a two-layer form-factor reference board surrounded by extensions and development options. The product's real form size can be removed and enclosed in plastic covers. All cordless phone features are implemented on the board via the software reference design package provided by DSP Group.


Different boards are utilized for handset and base development, demonstrating DSP Group's ability to deliver low-cost handsets (PP) and bases (FP). Both the handset and base are comprised of RF modules that provide a communications range of 300m outdoors and 50m indoors (for DECT).

The handset and base are designed to support DSP Group's software package, which includes firmware, communications protocol software, hosts, and MMIs, and enables full system evaluation and testing. Both the handset and base can be connected to an external PC via the JTAG interface for software debugging, evaluation and DSP emulation.


Comprised of a variety of boards and modules that cover diverse applications and cordless standards, the HDK E includes two main components:

  • DE56 baseband development chip on the main board
  • RF module assembled on the main board
    • RF19: RF chip for DECT applications
    • RF17 and RF24: RF chips for EDCT 2.4GHz and DECT 2.4GHz applications

 

The HDK E also offers the option of integrating the DE56 baseband development chip and RF chip on a combined small form-factor module that is assembled on the main board.

 

The HDK E board comes with all hardware collateral including user manual, block diagram, full schematics, bill of materials (BOM) component list, PCB layout, and Gerber files.

The DECT reference design package is accompanied by a complete DSP Group s/w reference design.

HDK E for DECT Handset Features

The HDK E reference design contains hardware that supports numerous handset features:

  • Baseband IC that performs all tasks required for an integrated telephone system
  • DECT 1.9GHz RF module
  • Diverse displays – color, B&W dot matrix and 14-segment LCD
  • LCD LEDS and keypad backlight
  • Full telephone keypad
  • Microphone, earpiece and speaker with audio control
  • I2C EEPROM for handset system configuration and parameter storing
  • Flash memory for software development and for storage of application data
  • Headset and corded handset connector
  • Power supply for battery level simulation or battery compartment
  • Fast battery charging option and assembly option for trickle charging
  • JTAG interfaces for s/w development, debug and diagnostics options

HDK E for DECT Base Features

The reference design contains hardware that supports numerous base features:

  • Baseband IC for all tasks required for an integrated telephone system
  • DECT 1.9GHz RF module
  • Telephone circuit (DAA) that supports CID, Russian and Dutch telephone exchanges
  • Full telephone keypad
  • I2C EEPROM for handset system configuration and CID number storing
  • Flash memory for software development and DTAM option

  • Circuit for detecting and charging handset when sitting on cradle
  • Talk and charging LEDS indication
  • 7-segment display
  • Buzzer option for providing basic sounds
  • JTAG interface for s/w development, debugging and diagnostics options
 

Product Graphics

Handset Block Diagram

Handset Block Diagram

Base Block Diagram

Base Block Diagram

XcorE HDK Base

XcorE HDK Handset